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当前位置:首页   >  产品中心  >  钙钛矿材料  >  密封剂  >  MS004685Two Part Interconnect Polymer——双部件互连聚合物

Two Part Interconnect Polymer——双部件互连聚合物

简要描述:用Dyesol的两部分连接在Dyesol的两部分中性组装聚合物结合聚合物创造系列玻璃基板之间的导电连接连接DSC瓷砖。

  • 产品型号:MS004685
  • 厂商性质:代理商
  • 更新时间:2017-02-20
  • 访  问  量:502

详细介绍

Dyesol’s Two Part Interconnect Polymer is a black, flexible neutral curing conductive material formulated to provide a series connection, in conjunction with Dyesol’s Two Part Neutral Assembly Polymer, as part of the primary sealing component in Dye Solar Cell prototype tiles. The formulation utilises tungsten metal to achieve conductivity and the cured material exhibits excellent chemical stability. Curing will occur at 50°C with accelerated curing times achieved with temperatures up to 80°C.——Dyesol的两部分连接的聚合物是一个黑色的、灵活的中性固化导电材料配方,提供一系列的连接,在与Dyesol的两部分中性聚合物连接组件,作为染料太阳能电池原型砖的主要密封部件的一部分。配方采用钨金属实现电导率和固化材料具有优良的化学稳定性TY。固化将发生在50°C与加速固化时间达到温度高达80°C.

To ensure the tungsten component of the formulation remains evenly suspended the syringes must be shipped in dry ice which incurs an additional shipping fee.
To ensure the tungsten component of the formulation remains evenly suspended during storage the syringes require rotation. Dyesol offers a Syringe Carousel for this purpose. 

Consider also purchasing: Dyesol’s Two Part Hermetic Sealing Compound, Two Part Neutral Assembly Polymer, Primary Seal & Interconnect Dispenser, Tile Assembly & Jigging, and Syringe Carousel.

 

ITEM #

SIZE

MS004685

50 grams

PECIFICATIONS

Quantities:

65ml as a pre-loaded syringe suitable for use in Dyesol’s Primary Seal & Interconnect Dispenser

Curing Temperature:

50-80°C

Mixing Ratio:

By volume 1:1

 

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